Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
https://www.scopus.com/inward/record.url?eid=2-s2.0-84929832756&partnerID=40&md5=1fb9921f20cd25af591cdc63c44ea357
Autores Principales: | Muller, Sebastián, Reuschel, Torsten, Rimolo-Donadio, Renato, Kwark, Young, Bruns, Heinz-Dietrich, Schuster, Christian |
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Institute of Electrical and Electronics Engineers Inc.
2017
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https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7111305 https://hdl.handle.net/2238/7179 |
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RepoTEC71792022-04-09T03:05:20Z Energy-Aware Signal Integrity Analysis for High-Speed PCB Links Muller, Sebastián Reuschel, Torsten Rimolo-Donadio, Renato Kwark, Young Bruns, Heinz-Dietrich Schuster, Christian Diseño Circuitos Placas electrónicas Potencia de entrada Potencia eléctrica Research Subject Categories::TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics https://www.scopus.com/inward/record.url?eid=2-s2.0-84929832756&partnerID=40&md5=1fb9921f20cd25af591cdc63c44ea357 This paper proposes a novel approach to evaluate design alternatives for high-speed links on printed circuit boards. The approach combines evaluations of signal integrity and link input power. For a comprehensive analysis, different link designs are made comparable through the application of identical constraints, with the link input power as the single figure of merit for a systematic, quantitative comparison of design alternatives. The analysis relies upon a combination of efficient physics-based via and trace models, statistical time-domain simulation, and an analytical input power evaluation, which allows it to handle links consisting of a large number of channels while fully taking into account interchannel crosstalk. The proposed approach is applied to study two fundamental design decisions at the PCB level—single-ended versus differential signaling and signal-to-ground via ratios of 1:1 versus 2:1—for a link consisting of 2048 vias and up to 175 striplines with an aggregate data rate of 1 Tb/s. It is found that both design decisions have a considerable impact on the required input power of the link. 2017-06-05T16:45:06Z 2017-06-05T16:45:06Z 2015-05 info:eu-repo/semantics/article https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7111305 00189375 https://hdl.handle.net/2238/7179 eng Attribution-NonCommercial 3.0 Costa Rica https://creativecommons.org/licenses/by-nc/3.0/cr/ application/pdf Institute of Electrical and Electronics Engineers Inc. IEEE Transcions on Electromagnetic Compatibility, vol. 57, no. 5, Octuber 2015 |
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Tecnológico de Costa Rica |
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Repositorio TEC |
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Inglés |
topic |
Diseño Circuitos Placas electrónicas Potencia de entrada Potencia eléctrica Research Subject Categories::TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics |
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Diseño Circuitos Placas electrónicas Potencia de entrada Potencia eléctrica Research Subject Categories::TECHNOLOGY::Electrical engineering, electronics and photonics::Electronics Muller, Sebastián Reuschel, Torsten Rimolo-Donadio, Renato Kwark, Young Bruns, Heinz-Dietrich Schuster, Christian Energy-Aware Signal Integrity Analysis for High-Speed PCB Links |
description |
https://www.scopus.com/inward/record.url?eid=2-s2.0-84929832756&partnerID=40&md5=1fb9921f20cd25af591cdc63c44ea357 |
format |
Artículo |
author |
Muller, Sebastián Reuschel, Torsten Rimolo-Donadio, Renato Kwark, Young Bruns, Heinz-Dietrich Schuster, Christian |
author_sort |
Muller, Sebastián |
title |
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links |
title_short |
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links |
title_full |
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links |
title_fullStr |
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links |
title_full_unstemmed |
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links |
title_sort |
energy-aware signal integrity analysis for high-speed pcb links |
publisher |
Institute of Electrical and Electronics Engineers Inc. |
publishDate |
2017 |
url |
https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7111305 https://hdl.handle.net/2238/7179 |
_version_ |
1785817073587322880 |
score |
12.140644 |