Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process
This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement...
| Autores Principales: | A.E., Kurnosenko, D.I., Arabov |
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| Formato: | Artículo |
| Idioma: | Inglés |
| Publicado: |
KnE Publishing
2017
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| Acceso en línea: |
https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347 http://ridda2.utp.ac.pa/handle/123456789/4347 |
| Sumario: |
This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement head and manipulator have to spend traveling through all component mounting positions. The problem is defined as the traveling salesman one. The article zeroed in distance/time matrix determination for dispensing/placement head and manipulator three-dimensional movements in the case of the selected kinematics diagram of the assembly equipment. Formulas for determination of this matrix are proposed, formal description of the optimization problem is presented, and a brief review of problem-solving methods is described. |
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